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Automated inspection (AXI) is a technology based on the same principles as automated optical inspection (AOI). It uses as its source, instead of visible light, to automatically inspect features, which are typically hidden from view. The increasing usage of ICs (integrated circuits) with packages such as BGAs (ball grid array) where the connections are underneath the chip and not visible, means that ordinary optical inspection is impossible. Because the connections are underneath the chip package there is a greater need to ensure that the manufacturing process is able to accommodate these chips correctly. Additionally the chips that use BGA packages tend to be the larger ones with many connections. Therefore, it is essential that all the connections are made correctly.〔(X-Ray Inspection for PCB and BGA )〕 AXI is often paired with the testing provided by boundary scan test, in-circuit test, and functional test. == Process == As BGA connections are not visible the only alternative is to use a low level inspection. AXI is able to find faults such as opens, shorts, insufficient solder, excessive solder, missing electrical parts, and mis-aligned components. Defects are detected and repaired within short debug time. These inspection systems are more costly than ordinary optical systems, but they are able to check all the connections, even those underneath the chip package. 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「Automated X-ray inspection」の詳細全文を読む スポンサード リンク
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