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The FeaturePak standard defines a small form factor card for I/O expansion of embedded systems and other space-constrained computing applications. The cards are intended to be used for adding a wide range of capabilities, such as A/D, D/A, digital I/O, counter/timers, serial I/O, wired or wireless networking, image processing, GPS, etc. to their host systems. FeaturePak cards plug into edgecard sockets, parallel to the mainboard, similarly to how SO-DIMM memory modules install in laptop or desktop PCs. ==Socket Interface== The FeaturePak socket consists of a 230-pin "MXM" connector, which provides all connections to the FeaturePak card, including the host interface, external I/O signals, and power. (Note, however, that the FeaturePak specification's use of the MXM connector differs from that of Nvidia's MXM specification.〔 (【引用サイトリンク】 url = http://www.nvidia.com/object/PO_MXM_UK.html )〕) Host interface connections include: *PCI Express -- up to two PCI Express x1 lanes *USB -- up to two USB 1.1 or 2.0 channels *Serial—one logic-level UART interface *SMBus *JTAG *PCI Express Reset *Several auxiliary signals *3V and 5V power and ground *Reserved lines (for future enhancements) The balance of the 230-pin FeaturePak socket is allocated to I/O, in two groups: *Primary I/O—50 general purpose I/O lines, of which 34 pairs have enhanced isolation *Secondary I/O—50 general purpose I/O lines The FeaturePak socket's MXM connector is claimed capable of 2.5 Gbit/s bandwidth on each pin, thereby supporting high-speed interfaces such as PCI Express, gigabit Ethernet, USB 2.0, among others. Enhanced I/O signal isolation within the Primary I/O group is accomplished by leaving alternate pins on the MXM connector interface unused. FeaturePak cards are powered by 3.3V and use standard 3.3V logic levels. The socket also provides a 5V input option, for cards that require the additional voltage to power auxiliary functions. Other than the provision of extra isolation for 34 signal pairs, there is no defined allocation of the signals within the Primary I/O and Secondary I/O groups, leaving each FeaturePak to define its own utilization of the I/O signals. Consequently, there is little limitation as to what can be implemented on a FeaturePak card. 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「FeaturePak」の詳細全文を読む スポンサード リンク
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