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The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices. For the purpose of this standard, the term "devices" includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices.〔http://www.rocelec.com/content/FLOW-SMD-QML-Mil-2010-Datasheet-LR.pdf〕 ==Environmental tests, methods 1001-1034== * 1001 Barometric pressure, reduced (altitude operation) * 1002 Immersion * 1003 Insulation resistance * 1004.7 Moisture resistance * 1005.8 Steady-state life * 1006 Intermittent life * 1007 Agree life * 1008.2 Stabilization bake * 1009.8 Salt atmosphere * 1010.8 Temperature cycling * 1011.9 Thermal shock * 1012.1 Thermal characteristics * 1013 Dew point * 1014.13 Seal * 1015.10 Burn-in test * 1016.2 Life/reliability characterization tests * 1017.2 Neutron irradiation * 1018.6 Internal gas analysis * 1019.8 Ionizing radiation (total dose) test procedure * 1020.1 Dose rate induced latchup test procedure * 1021.3 Dose rate upset testing of digital microcircuits * 1022 Mosfet threshold voltage * 1023.3 Dose rate response of linear microcircuits * 1030.2 Preseal burn-in * 1031 Thin film corrosion test * 1032.1 Package induced soft error test procedure * 1033 Endurance life test * 1034.1 Die penetrant test 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「MIL-STD-883」の詳細全文を読む スポンサード リンク
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