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LGA 2011, also called ''Socket R'', is a CPU socket by Intel. Released on 14 November 2011, it replaces Intel's LGA 1366 (Socket B) and LGA 1567 in the performance and high-end desktop and server platforms.〔(【引用サイトリンク】 title= Sandy Bridge-E and MSI X79 preview )〕 The socket has 2011 protruding pins that touch contact points on the underside of the processor. The LGA 2011 socket uses QPI to connect the CPU to additional CPUs. DMI 2.0 is used to connect the processor to the PCH. The memory controller and 40 PCI Express (PCIe) lanes are integrated on the CPU. On a secondary processor an extra ×4 PCIe interface replaces the DMI interface. As with its predecessor LGA 1366, there is no provisioning for integrated graphics. This socket supports four DDR3 or DDR4 SDRAM memory channels with up to three unbuffered or registered DIMMs per channel, as well as up to 40 PCI Express 2.0 or 3.0 lanes.〔(【引用サイトリンク】title=Intel Core i7 Processor Family LGA-2011 Socket Datasheet, Vol. 1 )〕 LGA 2011 also has to ensure platform scalability beyond eight cores and 20 MB of cache. The LGA 2011 socket is used by Sandy Bridge-E/EP and Ivy Bridge-E/EP processors with the corresponding X79 (E enthusiast class) and C600-series (EP Xeon class) chipsets. LGA 2011-1, an updated generation of the socket and the successor of LGA 1567, is used for Ivy Bridge-EX (Xeon E7 v2) CPUs, which were released in February 2014. LGA 2011-v3 (also referred to as LGA 2011-3) is another updated generation of the socket, used for Haswell-E and Haswell-EP CPUs, which were released in August and September 2014, respectively. Updated socket generations are physically similar to LGA 2011, but the used electrical signals and ILM keying prevent them from being backward compatible with older CPUs. == Physical design and socket generations == Intel CPU sockets use the so-called ''Independent Loading Mechanism'' (ILM) retention device that holds the CPU in place while applying an exact amount of force required for a CPU to be properly seated. As part of their design, ILMs have differently placed protrusions which are intended to mate with cutouts in CPU packagings. These protrusions, also known as ''ILM keying'', have the purpose of preventing installation of incompatible CPUs into otherwise physically compatible sockets, and preventing ILMs to be mounted with a 180-degree rotation relative to the CPU socket. Different variants (or generations) of the LGA 2011 socket and associated CPUs come with different ILM keying, which makes it possible to install CPUs only into generation-matching sockets. CPUs that are intended to be mounted into ''LGA 2011-0'', ''LGA 2011-1'' or ''LGA 2011-v3'' sockets are all mechanically compatible regarding their dimensions and ball pattern pitches, but the designations of contacts are different between generations of the LGA 2011 socket and CPUs, thus making them electrically and logically incompatible. Original LGA 2011 socket is used for Sandy Bridge-E/EP and Ivy Bridge-E/EP processors, while LGA 2011-1 is used for Ivy Bridge-EX (Xeon E7 v2) CPUs, which were released in February 2014. LGA 2011-v3 socket is used for Haswell-E and Haswell-EP CPUs, which were released in August and September 2014, respectively.〔〔〔 Two types of ILM exist, with different shapes and heatsink mounting hole patterns: ''square ILM'' (80×80 mm mounting pattern), and ''narrow ILM'' (56×94 mm mounting pattern). Square ILM is the standard type, while the narrow one is alternatively available for space-constrained applications.〔(Intel Core i7 Processor Families for the LGA2011-0 Socket, Mechanical Drawings ), page 108-114. Intel〕 A matching heatsink is required for each ILM type.〔(Intel Socket LGA2011 CPU and Heatsinks ) PCstats, 27 July 2013.〕 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「LGA 2011」の詳細全文を読む スポンサード リンク
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