| 翻訳と辞書 |
Through-hole technology
Through-hole technology, also spelled "thru-hole", refers to the mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side either by manual assembly (hand placement) or by the use of automated insertion mount machines.〔''Electronic Packaging:Solder Mounting Technologies'' in K.H. Buschow et al (ed), ''Encyclopedia of Materials:Science and Technology'', Elsevier, 2001 ISBN 0-08-043152-6, pages 2708-2709〕
== History ==
Through-hole technology almost completely replaced earlier electronics assembly techniques such as point-to-point construction. From the second generation of computers in the 1950s until surface-mount technology (SMT) became popular in the late 1980s, every component on a typical PCB was a through-hole component. PCBs initially had tracks printed on one side only, later both sides, then multi-layer boards were in use. Through holes became plated-through holes (PTH) in order for the components to make contact with the required conductive layers. Plated-through holes are no longer required with SMT boards for making the component connections, but are still used for making interconnections between the layers and in this role are more usually called vias.〔
抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』
■ウィキペディアで「Through-hole technology」の詳細全文を読む
スポンサード リンク
| 翻訳と辞書 : 翻訳のためのインターネットリソース |
Copyright(C) kotoba.ne.jp 1997-2016. All Rights Reserved.
|
|