| 翻訳と辞書 |
| Tin-silver-copper ： ウィキペディア英語版 |
Tin-silver-copper
Tin-silver-copper (SnAgCu, also known as SAC), is a lead-free (Pb-free) alloy commonly used in solder. The tin-silver-copper alloy has been the prevailing alloy system used to replace tin-lead because it is near eutectic, with adequate thermal fatigue properties, strength, and wettability.〔(Lead-Free Solder FAQ’s )〕 Lead-free solder is gaining much attention as the environmental effects of lead in industrial products is recognized, and as a result of Europe’s RoHS legislation to remove lead and other hazardous materials from electronics. Japanese electronics companies have also looked at Pb-free solder for its industrial advantages.
==Applications==
SAC alloys are the main choice for lead-free surface-mount technology (SMT) assembly in the electronics industry.〔Peter Biocca, (Lead-free SMT Soldering Defects: How to Prevent Them ), mirror: (Lead-Free Defects in Reflow Soldering – How to Prevent Them ), emsnow, Feb 17, 2005〕 SMT is a process where components of circuit assemblies are mounted directly onto the surface of a printed circuit board and soldered in place. SMT has largely replaced “through-hole technology” where components are fitted with wire leads into holes in the circuit board.
抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』
■ウィキペディアで「Tin-silver-copper」の詳細全文を読む
スポンサード リンク
| 翻訳と辞書 : 翻訳のためのインターネットリソース |
Copyright(C) kotoba.ne.jp 1997-2016. All Rights Reserved.
|
|